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BUK7511-55A Datasheet(PDF) 5 Page - NXP Semiconductors

No. de pieza BUK7511-55A
Descripción Electrónicos  TrenchMOS standard level FET
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BUK7511-55A Datasheet(HTML) 5 Page - NXP Semiconductors

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Philips Semiconductors
BUK7511-55A; BUK7611-55A
TrenchMOS™ standard level FET
Product specification
Rev. 01 — 1 February 2001
5 of 15
9397 750 07817
© Philips Electronics N.V. 2001. All rights reserved.
8.
Characteristics
Table 5:
Characteristics
Tj =25 °C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source breakdown
voltage
ID = 0.25 mA; VGS =0V
Tj =25 °C55
−−
V
Tj = −55 °C50
−−
V
VGS(th)
gate-source threshold voltage ID = 1 mA; VDS =VGS;
Figure 9
Tj =25 °C2
3
4
V
Tj = 175 °C1
−−
V
Tj = −55 °C
−−
4.4
V
IDSS
drain-source leakage current
VDS = 55 V; VGS =0V
Tj =25 °C
0.05
10
µA
Tj = 175 °C
−−
500
µA
IGSS
gate-source leakage current
VGS = ±20 V; VDS =0V
2
100
nA
RDSon
drain-source on-state
resistance
VGS =10V; ID =25A;
Figure 7 and 8
Tj =25 °C
911
m
Tj = 175 °C
−−
22
m
Dynamic characteristics
Ciss
input capacitance
VGS =0V; VDS =25V;
f = 1 MHz; Figure 12
2230
3093
pF
Coss
output capacitance
510
645
pF
Crss
reverse transfer capacitance
290
467
pF
td(on)
turn-on delay time
VDD = 30 V; RL = 1.2 Ω;
VGS =10V; RG =10 Ω;
18
ns
tr
rise time
90
ns
td(off)
turn-off delay time
84
ns
tf
fall time
68
ns
Ld
internal drain inductance
from drain lead 6 mm from
package to centre of die
4.5
nH
from contact screw on
mounting base to centre of
die SOT78
3.5
nH
from upper edge of drain
mounting base to centre of
die SOT404
2.5
nH
Ls
internal source inductance
from source lead to source
bond pad
7.5
nH


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