4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

[Standard Conditions for Reflow Soldering]

mechanical strength of the components will decrease

because a sudden temperature change causes

Infrared Reflow

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB board.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

2. Solderability of Tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

Tin is used. Please confirm the Solderability of Tin plated

termination chips before use.

Vapor Reflow

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

shown in the table 1.

Table 1

[Allowable Soldering Temperature and Time]

Recommended Conditions

Infrared Reflow

Vapor Reflow

Peak Temperature

230～250℃

230～240℃

240～260℃

Atmosphere

Air

Air

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in

a excessive solder fillet height.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

the chips to crack.

in section

4-2. Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.

Make sure not to impose any abnormal mechanical shocks to the PCB.

Pb-Sn Solder

Lead Free Solder

Inverting the PCB

Caution

Part Number

Temperature Differential

GNM0M/GNM1M/GNM21/

GNM31

ΔT≦130℃

!

Temperature(℃)

Peak Temperature

170℃

150℃

130℃

200℃

Soldering

Gradual

Cooling

Preheating

ΔT

60-120 seconds

30-60 seconds

Time

Soldering Time(sec.)

280

270

260

250

240

230

220

0

30

60

120

90

Temperature(℃)

Peak Temperature

170℃

150℃

130℃

ΔT

Soldering

Gradual

Cooling

Preheating

Time

60-120 seconds 20 seconds max.

0.2mm min

JEMCCC-0010Q

16