2. Land Dimensions

2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area

is larger than needed and has an excess amount of solder.

Please refer to the land dimensions in table 1 for reflow soldering.

Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

GNM□□2

GNM□□4

Table 1 Reflow Soldering Method

Dimensions

Part Number

GNM0M2

0.9×0.6

0.12 to 0.20 **

0.35 to 0.40 **

0.30

0.45

GNM1M2

1.37×1.0

0.4 to 0.5 *

0.35 to 0.45 *

0.3 to 0.35

0.64

GNM212

2.0×1.25

0.6 to 0.7

0.5 to 0.7

0.4 to 0.5

1.0

GNM214

2.0×1.25

0.6 to 0.7

0.5 to 0.7

0.25 to 0.35

0.5

GNM314

3.2×1.6

0.8 to 1.0

0.7 to 0.9

0.3 to 0.4

0.8

(in mm)

* a+2b < 1.35

** 0.82≦a+2b≦1.0

c

p

Notice

L×W

a

b

JEMCCC-0010Q

22