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HMC913 Datasheet(PDF) 9 Page - Analog Devices

No. de Pieza. HMC913
Descripción  SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA)
Descarga  9 Pages
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Fabricante  AD [Analog Devices]
Página de inicio  http://www.analog.com
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HMC913 Datasheet(HTML) 9 Page - Analog Devices

   
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For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
9
HMC913
v04.0913
SUCCESSIVE DETECTION LOG VIDEO
AMPLIFER (SDLVA), 0.6 - 20 GHz
Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC gen-
eral Handling, Mounting , Bonding Note).
50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film
substrates are recommended for bringing RF to and from the chip (Figure 1).
Microstrip substrates should be placed as close to the die as possible in order to
minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152
mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective con-
tainers, and then sealed in an ESD protective bag for shipment. Once the sealed
ESD protective bag has been opened, all die should be stored in a dry nitrogen
environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean
the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: The chip may be handled by a vacuum collet or with a sharp pair of tweezers.
Mounting
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
0.279mm (0.011”) Thick MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D


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