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MCR100 Datasheet(PDF) 3 Page - ON Semiconductor |
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MCR100 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 6 page MCR100 Series http://onsemi.com 3 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance,Junction−to−Case Junction−to−Ambient RqJC RqJA 75 200 °C/W Lead Solder Temperature ( t1/16″ from case, 10 secs max) TL 260 °C ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (Note 2) TC = 25°C (VD = Rated VDRM and VRRM; RGK = 1 kW)TC = 110°C IDRM, IRRM − − − − 10 100 mA ON CHARACTERISTICS Peak Forward On−State Voltage* (ITM = 1.0 A Peak @ TA = 25°C) VTM − − 1.7 V Gate Trigger Current (Continuous dc) (Note 3) TC = 25°C (VAK = 7.0 Vdc, RL = 100 W) IGT − 40 200 mA Holding Current(2) TC = 25°C (VAK = 7.0 Vdc, Initiating Current = 20 mA) TC = −40°C IH − − 0.5 − 5.0 10 mA Latch Current TC = 25°C (VAK = 7.0 V, Ig = 200 mA) TC = −40°C IL − − 0.6 − 10 15 mA Gate Trigger Voltage (Continuous dc) (Note 3) TC = 25°C (VAK = 7.0 Vdc, RL = 100 W)TC = −40°C VGT − − 0.62 − 0.8 1.2 V DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off−State Voltage (VD = Rated VDRM, Exponential Waveform, RGK = 1000 W,TJ = 110°C) dV/dt 20 35 − V/ ms Critical Rate of Rise of On−State Current (IPK = 20 A; Pw = 10 msec; diG/dt = 1 A/msec, Igt = 20 mA) di/dt − − 50 A/ ms *Indicates Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%. 2. RGK = 1000 W included in measurement. 3. Does not include RGK in measurement. + Current + Voltage VTM IDRM at VDRM IH Symbol Parameter VDRM Peak Repetitive Off State Forward Voltage IDRM Peak Forward Blocking Current VRRM Peak Repetitive Off State Reverse Voltage IRRM Peak Reverse Blocking Current VTM Peak on State Voltage IH Holding Current Voltage Current Characteristic of SCR Anode + on state Reverse Blocking Region (off state) Reverse Avalanche Region Anode − Forward Blocking Region IRRM at VRRM (off state) |
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