NB3H5150−01

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Figure 20. Via Layout Recommendation for Exposed Pad, QFN−32 Package

The exposed pad on the NB3H5150−01 QFN−32 package carries all of the power supply return currents. It is therefore

important that the necessary current capability be satisfied, as well as the thermal transfer from the die to the PCB. Figure 20

shows a recommended via layout pattern for the exposed pad. Via spacing = 0.02”, filled vias preferred.

ORDERING INFORMATION

Device

Marking

Tables

Package

NB3H5150−01MNTXG

NB3H

5150−01

3 & 4

QFN−32

(Pb−Free)

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.