74LVC3G07 datasheet(2/14 Pages) PHILIPS

No. de pieza	74LVC3G07

Descripción Electrónicos	Triple buffer with open-drain output

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Fabricante Electrónico	PHILIPS [NXP Semiconductors]

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9397 750 14542

Product data sheet

Rev. 03 — 01 February 2005

2 of 14

Philips Semiconductors

74LVC3G07

Triple buffer with open-drain output

3.

Quick reference data

[1]

CPD is used to determine the dynamic power dissipation (PD in µW).

PD =CPD × VCC2 × fi × N+ ∑(CL × VCC2 × fo) where:

fi = input frequency in MHz;

fo = output frequency in MHz;

CL = output load capacitance in pF;

VCC = supply voltage in Volts;

N = number of inputs switching;

∑(C

L × VCC

2

× f

o) = sum of outputs.

[2]

The condition is VI = GND to VCC.

4.

Ordering information

5.

Marking

Table 1:

Quick reference data

GND = 0 V; Tamb = 25 °C.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

tPLZ, tPZL

propagation delay

input nA to output nY

VCC = 1.8 V;

CL = 30 pF; RL = 1 kΩ

-

2.9

-

ns

VCC = 2.5 V;

CL = 30 pF; RL = 500 Ω

-

1.7

-

ns

VCC = 2.7 V;

CL = 50 pF; RL = 500 Ω

-

2.3

-

ns

VCC = 3.3 V;

CL = 50 pF; RL = 500 Ω

-

2.1

-

ns

VCC = 5.0 V;

CL = 50 pF; RL = 500 Ω

-

1.5

-

ns

CI

input capacitance

-

2.5

-

pF

CPD

power dissipation

capacitance per gate

VCC = 3.3 V

[1] [2] -

6.5

-

pF

Table 2:

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVC3G07DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads; body

width 3 mm; lead length 0.5 mm

SOT505-2

74LVC3G07DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package; 8 leads;

body width 2.3 mm

SOT765-1

74LVC3G07GT

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package; no leads;

8 terminals; body 1

× 1.95 × 0.5 mm

SOT833-1

Table 3:

Marking codes

Type number

Marking code

74LVC3G07DP

V07

74LVC3G07DC

V07

74LVC3G07GT

V07

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