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ADC12DL066 Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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ADC12DL066 Datasheet(HTML) 4 Page - National Semiconductor (TI) |
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4 / 23 page  Pin Descriptions and Equivalent Circuits (Continued) Pin No. Symbol Equivalent Circuit Description 24–29 34–39 DA0–DA11 Digital data output pins that make up the 12-bit conversion results of their respective converters. DA0 and DB0 are the LSBs, while DA11 and DB11 are the MSBs of the output word. Output levels are TTL/CMOS compatible. 42–47 52–57 DB0–DB11 ANALOG POWER 9, 18, 19, 62, 63 V A Positive analog supply pins. These pins should be connected to a quiet +3.3V source and bypassed to AGND with 0.1 µF capacitors located within 1 cm of these power pins, and with a 10 µF capacitor. 3, 8, 10, 17, 20, 61, 64 AGND The ground return for the analog supply. DIGITAL POWER 33, 48 V D Positive digital supply pin. This pin should be connected to the same quiet +3.3V source as is V A and be bypassed to DGND with a 0.1 µF capacitor located within 1 cm of the power pin and with a 10 µF capacitor. 32, 49 DGND The ground return for the digital supply. 30, 51 V DR Positive digital supply pin for the ADC12DL066’s output drivers. This pin should be connected to a voltage source of +2.4V to V D and be bypassed to DR GND with a 0.1 µF capacitor. If the supply for this pin is different from the supply used for V A and VD, it should also be bypassed with a 10 µF capacitor. V DR should never exceed the voltage on V D. All bypass capacitors should be located within 1 cm of the supply pin. 23, 31, 40, 50, 58 DR GND The ground return for the digital supply for the ADC12DL066’s output drivers. These pins should be connected to the system digital ground, but not be connected in close proximity to the ADC12DL066’s DGND or AGND pins. See Section 5 (Layout and Grounding) for more details. www.national.com 4 |
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