© 2004 California Micro Devices Corp. All rights reserved.

07/29/04

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

▲ Tel: 408.263.3214

▲ Fax: 408.263.7846

▲ www.calmicro.com

3

CM3018

PRELIMINARY

Package / Ordering Information (Cont’d)

Chip Scale Package

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "

EN

BYP

VOUT

VIN

A1

A3

C3

C1

GND

B2

Pin "A1"

Marking

A1

23

1

C

B

A

Orientation

Marking

(see note 2)

PACKAGE / PINOUT DIAGRAM

Notes:

CM3018

CSP Package

TOP VIEW

BOTTOM VIEW

(Bumps Down View)

(Bumps Up View)

2) Lead-free devices are specified by using a "+" character for the top side orientation mark.

1) These drawings are not to scale.

PART NUMBERING INFORMATION

CSP

BUMPS

Output Voltage

Package

Standard Finish

Ordering Part

Part Marking

Ordering Part

Part Marking

5

1.5V

CSP

CM3018-15CS

MA

CM3018-15CP

MA

5

1.8V

CSP

CM3018-18CS

MB

CM3018-18CP

MB

5

2.5V

CSP

CM3018-25CS

MC

CM3018-25CP

MC

5

2.6V

CSP

CM3018-26CS

MD

CM3018-26CP

MD

5

2.8V

CSP

CM3018-28CS

ME

CM3018-28CP

ME

5

2.85V

CSP

CM3018-2JCS

MF

CM3018-2JCP

MF

5

2.9V

CSP

CM3018-29CS

MG

CM3018-29CP

MG

5

3.0V

CSP

CM3018-30CS

MH

CM3018-30CP

MH

5

3.1V

CSP

CM3018-31CS

MJ

CM3018-31CP

MJ

5

3.3V

CSP

CM3018-33CS

MK

CM3018-33CP

MK