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LM3552 Datasheet(Hoja de datos) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No. de Pieza. LM3552
Descripción  1A White LED Driver with Flash Timeout Protection
Descarga  15 Pages
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Fabricante  NSC [National Semiconductor (TI)]
Página de inicio  http://www.national.com
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Electrical Characteristics(Notes 2, 9) (Continued)
Limits in standard typeface are for T
J = +25˚ C. Limits in boldface type apply over the full operating junction temperature range
(-40˚C
≤ T
J
≤ +110˚C). Unless otherwise noted, specifications apply to the LM3551 and LM3552 Typical Application Circuit (pg.
1) with: V
IN = 3.6V, V(SD) = 0V for LM3551 and V(EN) = VIN for LM3552, ILOAD = 0A (Note 10)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Th
T/F
T/F Pin Threshold
Output High
1.2
V
Output Low
0.3
UVP
Under Voltage Protection
Thresholds
On Threshold
2.25
2.48
2.70
V
Off Threshold
2.43
2.58
2.77
OVP
Over Voltage Protection
Thresholds
On Threshold
11
12.4
14
V
Off Threshold
9.2
10.6
12
V
FTO
Flash Timeout trip-point
0.99
1.16
1.32
V
I
FTO
Flash Timeout Current
1.12
1.4
1.68
µA
V
SS
Soft-Start Voltage
1.18
1.25
1.32
V
I
SS
Soft-Start Current
10
11.5
13
µA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=140
oC (typ.) and disengages at
TJ=120
oC (typ.).
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note: AN-1187 for Recommended Soldering
Profiles.
Note 5: The human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. (MIL-STD-883 3015.7)
Note 6: Maximum recommended SW pin voltage when the OVP pin is grounded.
Note 7: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =110
oC), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX).
Note 8: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 9: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm.
Unless otherwise specified, conditions for Typ specifications are: VIN = 3.6V and TA =25
oC.
Note 10: CIN and COUT,: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
Note 11: Duty cycle affects current limit due to ramp generator.
Note 12: Current limit at 0% duty cycle. See TYPICAL PERFORMANCE section for Switch Current Limit vs. VIN
Note 13: Bias current flows into FB pin.
www.national.com
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