Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
N32707U2DN Datasheet(PDF) 5 Page - Nuvoton Technology Corporation |
|
N32707U2DN Datasheet(HTML) 5 Page - Nuvoton Technology Corporation |
5 / 47 page N3290X DATASHEET Nuvoton Technology Corp. 5 Release Date: May. 2013 http://www.nuvoton.com/ Rev. A5.1 1. GENERAL DESCRIPTION The N3290xUxDN is built on the ARM926EJ-S CPU core and integrated with JPEG codec, CMOS sensor interface, 32-channel SPU (Sound Processing Unit), ADC, DAC, for meeting various kinds of application needs while saving the BOM cost. The combination of ARM926 @ 200MHz, synchronous DRAM, 2D BitBLT accelerator, CMOS image sensor interface, LCD panel interface, USB 1.1 Host & USB2.0 HS Device makes the N3290xUxDN the best choice for LCD ELA devices. Maximum resolution for the N3290xUxDN is XVGA (1,024x768) @ TFT LCD panel. The 2D BitBLT accelerator accelerates the graphic compution to make the rendering smooth and off-load CPU to save power consumption. The N3290xUxDN is well-positioned in terms of cost/performance for the applications which bitmap graphics is extensively used or CMOS Image Sensor (CIS) interface is required. The N3290xUxDN is for application under Linux OS and leverage the driver availability of emerging functionalities like Wi-Fi, browser, etc. On the other hand, the open source code environment also give the product development more flexible. To meet the different requirement of the overall system BOM cost, the different size of DRAM is stacked with N3290x main SoC into one package, that is, multi-chip package (MCP). The N32901U1DN is particularly designed with the 128-pin LQFP package and the 1Mbitx16 SDRAM is stacked inside the MCP. The N32903U1DN is particularly designed with the 128-pin LQFP package and the 4Mbitx16 SDRAM is stacked inside the MCP. The 16Mbitx16 SDRAM is stacked inside the N32905UxDN MCP to ensure higher performance and minimize the system design efforts, like EMI & noise coupling. Total BOM cost could be reduced by employing 2-layer PCB along with the elimination of damping resistors, EMI prevention components, etc. Advantages including, but not limited to, less PCB space, shorter lead time, and higher / reliable production yield. 1.1 Applications ELA (Educational Learning Aid) HMI Security Home Appliance Advertisement |
Número de pieza similar - N32707U2DN |
|
Descripción similar - N32707U2DN |
|
|
Enlace URL |
Política de Privacidad |
ALLDATASHEET.ES |
¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |