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BUK9510-55A Datasheet(PDF) 2 Page - NXP Semiconductors |
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BUK9510-55A Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 14 page Philips Semiconductors BUK9510-55A; BUK9610-55A TrenchMOS™ logic level FET Product data Rev. 01 — 20 August 2001 2 of 14 9397 750 08555 © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 5. Quick reference data 6. Limiting values [1] Current is limited by power dissipation chip rating [2] Continuous current is limited by package Table 2: Quick reference data Symbol Parameter Conditions Typ Max Unit VDS drain-source voltage (DC) - 55 V ID drain current (DC) Tmb =25 °C; VGS =5V [1] - 100 A Ptot total power dissipation Tmb =25 °C - 200 W Tj junction temperature - 175 °C RDSon drain-source on-state resistance Tj =25 °C; VGS =5V; ID =25A 8 10 m Ω Tj =25 °C; VGS = 4.5 V; ID =25A - 11 m Ω Tj =25 °C; VGS = 10 V; ID = 25 A 7 9 m Ω Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage (DC) - 55 V VDGR drain-gate voltage (DC) RGS =20kΩ -55 V VGS gate-source voltage (DC) - ±15 V ID drain current (DC) Tmb =25 °C; VGS =5V Figure 2 and 3 [1] - 100 A [2] -75 A Tmb = 100 °C; VGS =5V; Figure 2 [2] -70 A IDM peak drain current Tmb =25 °C; pulsed; tp ≤ 10 µs Figure 3 - 400 A Ptot total power dissipation Tmb =25 °C; Figure 1 - 200 W Tstg storage temperature −55 +175 °C Tj operating junction temperature −55 +175 °C Source-drain diode IDR reverse drain current (DC) Tmb =25 °C [1] - 100 A [2] -75 A IDRM pulsed reverse drain current Tmb =25 °C; pulsed; tp ≤ 10 µs - 400 A Avalanche ruggedness WDSS non-repetitive avalanche energy unclamped inductive load; ID =75A; VDS ≤ 55 V; VGS =5V; RGS =50 Ω; starting Tmb =25 °C - 333 mJ |
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