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ADS1207IDGKT Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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ADS1207IDGKT Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 8 page ADS1206 ADS1207 SBAS311 − MARCH 2004 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT MAXIMUM INTEGRAL LINEARITY ERROR (%FS) MAXIMUM GAIN ERROR (%) PACKAGE- LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS1206 ±0.012 ±0.7 VSSOP-8 DGK −40 °C to +85°C TBD ADS1206IDGKT Tape and Reel, 250 ADS1206 ±0.012 ±0.7 VSSOP-8 DGK −40 °C to +85°C TBD ADS1206IDGKR Tape and Reel, 2000 ADS1207 ±0.012 ±0.7 VSSOP-8 DGK −40 °C to +85°C TBD ADS1207IDGKT Tape and Reel, 250 ADS1207 ±0.012 ±0.7 VSSOP-8 DGK −40 °C to +85°C TBD ADS1207IDGKR Tape and Reel, 2000 (1) For the most current package and ordering information, refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) ADS1204 UNIT Supply Voltage, GND to VDD −0.3 to 7 V Analog Input Voltage with Respect to GND GND − 0.3 to VDD + 0.3 V Reference Input Voltage with Respect to GND GND − 0.3 to VDD + 0.3 V Digital Input Voltage with Respect to GND GND − 0.3 to VDD + 0.3 V Input Current to Any Pin Except Supply −20 to 20 mA Power Dissipation See Dissipation Rating Table Operating Virtual Junction Temperature Range, TJ −40 to +150 °C Operating Free-Air Temperature Range, TA −40 to +85 °C Storage Temperature Range, TSTG −65 to +150 °C Lead Temperature (1.6mm or 1/16-inch from case for 10s) +260 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN NOM MAX UNIT Supply Voltage, GND to VDD Low-Voltage Levels 3.0 3.6 V Supply Voltage, GND to VDD 5V Logic Levels 4.5 5 5.5 V Reference Input Voltage TBD 2.5 VDD V Analog Inputs BUF = 0 0 VREF V Analog Inputs BUF = 1 0.1 VDD − 0.2 V External Clock ADS1206 TBD 1 MHz External Clock ADS1207 TBD 4 MHz Operating Junction Temperature Range, TJ −40 105 °C (1) with reduced accuracy, minimum clock can go up to 500kHz. DISSIPATION RATING TABLE BOARD PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C(1) TA = 70°C POWER RATING TA = 85°C POWER RATING Low-K(2) DGK 469.6mW 3.756mW/ °C 300.5mW 244.2mW High-K(3) DGK 691.4mW 5.531mW/ °C 442.5mW 359.5mW (1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for informational purposes only. (2) The JEDEC Low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top of the board. (3) The JEDEC High-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on the top and bottom of the board. |
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