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ADS1207IDGKT Datasheet(PDF) 2 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
No. de pieza ADS1207IDGKT
Descripción Electrónicos  LOW-POWER, SYNCHRONOUS VOLTAGE-TO-FREQUENCY CONVERTER
Download  8 Pages
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Fabricante Electrónico  BURR-BROWN [Burr-Brown (TI)]
Página de inicio  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

ADS1207IDGKT Datasheet(HTML) 2 Page - Burr-Brown (TI)

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ADS1206
ADS1207
SBAS311 − MARCH 2004
www.ti.com
2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
MAXIMUM
INTEGRAL
LINEARITY
ERROR
(%FS)
MAXIMUM
GAIN
ERROR
(%)
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT MEDIA,
QUANTITY
ADS1206
±0.012
±0.7
VSSOP-8
DGK
−40
°C to +85°C
TBD
ADS1206IDGKT
Tape and Reel, 250
ADS1206
±0.012
±0.7
VSSOP-8
DGK
−40
°C to +85°C
TBD
ADS1206IDGKR
Tape and Reel, 2000
ADS1207
±0.012
±0.7
VSSOP-8
DGK
−40
°C to +85°C
TBD
ADS1207IDGKT
Tape and Reel, 250
ADS1207
±0.012
±0.7
VSSOP-8
DGK
−40
°C to +85°C
TBD
ADS1207IDGKR
Tape and Reel, 2000
(1) For the most current package and ordering information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
ADS1204
UNIT
Supply Voltage, GND to VDD
−0.3 to 7
V
Analog Input Voltage with Respect to GND
GND − 0.3 to VDD + 0.3
V
Reference Input Voltage with Respect to GND
GND − 0.3 to VDD + 0.3
V
Digital Input Voltage with Respect to GND
GND − 0.3 to VDD + 0.3
V
Input Current to Any Pin Except Supply
−20 to 20
mA
Power Dissipation
See Dissipation Rating Table
Operating Virtual Junction Temperature Range, TJ
−40 to +150
°C
Operating Free-Air Temperature Range, TA
−40 to +85
°C
Storage Temperature Range, TSTG
−65 to +150
°C
Lead Temperature (1.6mm or 1/16-inch from case for 10s)
+260
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
NOM
MAX
UNIT
Supply Voltage, GND to VDD
Low-Voltage Levels
3.0
3.6
V
Supply Voltage, GND to VDD
5V Logic Levels
4.5
5
5.5
V
Reference Input Voltage
TBD
2.5
VDD
V
Analog Inputs
BUF = 0
0
VREF
V
Analog Inputs
BUF = 1
0.1
VDD − 0.2
V
External Clock
ADS1206
TBD
1
MHz
External Clock
ADS1207
TBD
4
MHz
Operating Junction Temperature Range, TJ
−40
105
°C
(1) with reduced accuracy, minimum clock can go up to 500kHz.
DISSIPATION RATING TABLE
BOARD
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C(1)
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
Low-K(2)
DGK
469.6mW
3.756mW/
°C
300.5mW
244.2mW
High-K(3)
DGK
691.4mW
5.531mW/
°C
442.5mW
359.5mW
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for
informational purposes only.
(2) The JEDEC Low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top of the board.
(3) The JEDEC High-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on the top and bottom of the board.


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