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APFA3010SEEZGQBDC Datasheet(PDF) 2 Page - HK TO-GRACE TECHNOLOGY CO.,LTD.

No. de Pieza. APFA3010SEEZGQBDC
Descripción  3.0 x 1.0 mm Right Angle SMD Chip LED Lamp
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Fabricante  TO-GRACE [HK TO-GRACE TECHNOLOGY CO.,LTD.]
Página de inicio  http://www.to-grace.com/index.html
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APFA3010SEEZGQBDC Datasheet(HTML) 2 Page - HK TO-GRACE TECHNOLOGY CO.,LTD.

   
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© 2019 Kingbright. All Rights Reserved. Spec No: DSAJ4410 / 1203013228 Rev No: V.18B Date: 04/08/2019
Page 2 / 4
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
APFA3010SEEZGQBDC
Parameter
Symbol
Emitting Color
Value
Unit
Typ.
Max.
Wavelength at Peak Emission IF = 20mA
λpeak
Hyper Red
Green
Blue
630
515
460
-
nm
Dominant Wavelength IF = 20mA
λdom
[1]
Hyper Red
Green
Blue
621
525
465
-
nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA
Δλ
Hyper Red
Green
Blue
20
35
25
-
nm
Capacitance
C
Hyper Red
Green
Blue
25
45
100
-
pF
Forward Voltage IF = 20mA
VF
[2]
Hyper Red
Green
Blue
2.0
3.3
3.3
2.5
4.1
4.0
V
Reverse Current (VR = 5V)
IR
Hyper Red
Green
Blue
-
10
50
50
µA
Temperature Coefficient of λpeak
IF = 20mA, -10°C ≤ T ≤ 85°C
TCλpeak
Hyper Red
Green
Blue
0.13
0.05
0.04
-
nm/°C
Temperature Coefficient of λdom
IF = 20mA, -10°C ≤ T ≤ 85°C
TCλdom
Hyper Red
Green
Blue
0.06
0.03
0.03
-
nm/°C
Temperature Coefficient of VF
IF = 20mA, -10°C ≤ T ≤ 85°C
TCV
Hyper Red
Green
Blue
-1.9
-3
-3
-
mV/°C
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Parameter
Symbol
Value
Unit
Hyper Red
Green
Blue
Power Dissipation
PD
75
102.5
120
mW
Reverse Voltage
VR
5
5
5
V
Junction Temperature
Tj
115
115
115
°C
Operating Temperature
Top
-40 to +85
°C
Storage Temperature
Tstg
-40 to +85
°C
DC Forward Current
IF
30
25
30
mA
Peak Forward Current
IFM
[1]
195
150
150
mA
Electrostatic Discharge Threshold (HBM)
-
3000
450
250
V
Thermal Resistance (Junction / Ambient)
Rth JA
[2]
405
650
620
°C/W
Thermal Resistance (Junction / Solder point)
Rth JS
[2]
275
560
535
°C/W
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rth JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm
2 per pad).
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.


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