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MAX2202EWTT10 Datasheet(PDF) 2 Page - Maxim Integrated Products

No. de Pieza. MAX2202EWTT10
Descripción  RMS Power Detector
Descarga  8 Pages
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Fabricante  MAXIM [Maxim Integrated Products]
Página de inicio  http://www.maxim-ic.com
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MAX2202EWTT10 Datasheet(HTML) 2 Page - Maxim Integrated Products

   
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RMS Power Detector
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (NOTES 2)
DC ELECTRICAL CHARACTERISTICS
(VCC = 2.5V to 4.2V, TA = -40°C to +85°C, VENA = 2.7V, no RF signal applied. Typical values are at VCC = 2.8V, TA = +25°C, unless
otherwise noted.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 3: Guaranteed by production test at TA = +85°C and 800MHz. Guaranteed by design and characterization at TA = -40°C and
TA = +25°C, and over frequency limits.
Note 4: Guaranteed by design and characterization.
Note 5: Log conformance is defined with respect to 4 calibration points, -1dBm, -7dBm, -19dBm, and -29dBm, at TA = +25°C.
VCC to GND ...........................................................-0.3V to +4.5V
ENA, OUT, FILT to GND ........................................-0.3V to +3.0V
RFIN Input Power ...........................................................+10dBm
Continuous Power Dissipation (TA = +70
°C)
6-Bump WLP (derate 2.9mW/
°C above +70°C)...........232mW
Operating Temperature Range ...........................-40
°C to +85°C
Storage Temperature Range .............................-65
°C to +160°C
Junction Temperature .....................................................+150
°C
Soldering Temperature (reflow, Note 1)...........................+260
°C
6 WLP
Junction-to-Ambient Thermal Resistance (
θJA) ...........95°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
2.5
2.8
4.2
V
Supply Current
ICC
VCC = 2.8V, RF input = -29dBm to 0dBm
5.5
8.5
mA
Shutdown Supply Current
VENA = 0V
0.5
10
µA
ENA Logic-High Threshold
VIH
1.1
2.7
V
ENA Logic-Low Threshold
VIL
0
0.6
V
ENA Input Current
VENA = 1.1V or 0.6V
25
µA
AC ELECTRICAL CHARACTERISTICS
(VCC = 2.8V, TA = -40°C to +85°C, VENA = 2.7V, fRF = 800MHz to 2GHz, unless otherwise noted. Typical values are at TA = +25°C.)
(Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
RF Input Frequency
800
2000
MHz
Maximum Output Voltage
RFIN at 0dBm
1.05
1.31.5V
Minimum Output Voltage
No RF input power, VENA = 2.7V
250
450
mV
Minimum Input Power Level
+1dB input power step results in VOUT
increase > 23mV/dB (Note 4)
-29
dBm
Log Slope
[(VOUT at -1dBm) - (VOUT at -29dBm)]/28
23
33
43
mV/dB
Log Conformance Error with
10dB Step
(Notes 4, 5)
-1.0+1.0dB
Power-Detector Accuracy Due to
Temperature
RF input at -4dBm to -1dBm, TA = -20
°C to
+25
°C, and TA = +25°C to +85°C
±0.4dB
Note 1: Refer to Application Note 1891:
Wafer-level packaging (WLP) and its applications.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
CAUTION! ESD SENSITIVE DEVICE


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