Bond Pad mechanical Dimensions

X/Y Coordinates

Pad Size

Signal Name

Pad Number

X

Y

X

Y

Out 1

1

−281

617

92

92

Out 2

2

−281

490

92

92

Comp2

3

−281

363

92

92

V

DD

4

−281

236

92

92

RF

IN

5

−281

−617

92

92

V

RAMP

6

281

−617

92

92

TX_EN

7

281

−360

92

92

BS

8

281

−118

92

92

Comp1

9

281

20

92

92

GND

10

281

187

92

92

Note: Dimensions of the bond pad coordinates are in µm Origin of the coordinates: center of the die Coordinates refer to the center of the bond pad

Pin Descriptions

Pin

Name

Description

Power Supply

4

V

DD

Positive Supply Voltage

10

GND

Power Ground

Digital Inputs

7

TX_EN

Schmitt-triggered logic input. A LOW shuts down the whole

chip for battery saving purposes. A HIGH enables the chip.

8

BS

Schmitt-triggered Band Select pin. When BS = H, channel 1

(OUT1) is selected, when BS = L, channel 2 (OUT2) is

selected.

Analog Inputs

5

RF

IN

RF Input connected to the Coupler output with optional

attenuation to measure the Power Amplifier (PA) / Antenna

RF power levels.

6V

RAMP

Sets the RF output power level. The useful input voltage

range is from 0.2V to 1.8V, although voltages from 0V to V

DD

are allowed.

Compensation

9

Comp1

Connects an external RC network between the Comp1 pin

and the Comp2 pin for an overall loop compensation and to

control the closed loop frequency response. Conventional

loop stability techniques can be used in selecting this

network, such as Bode plots. A good starting value for the

RC combination will beC=68pFandR=0

Ω.

3

Comp2

Frequency compensation pin. The BS signal switches this pin

either to OUT1 or to OUT2.

Output

1

Out1

This pin is connected to the PA of either channel 1 or

channel 2.

2

Out2

Note: 1. All inputs and outputs are referenced to GND (pin 10).

3. RF power detection is performed internally in the LMV242 and only an RF power coupler with optional extra attenuation has to be used.

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