S-1172B44-U5T1X datasheet(7/35 Pages) ABLIC

No. de pieza	S-1172B44-U5T1X

Descripción Electrónicos	HIGH RIPPLE-REJECTION LOW DROPOUT HIGH OUTPUT CURRENT CMOS VOLTAGE REGULATOR

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HIGH RIPPLE-REJECTION LOW DROPOUT HIGH OUTPUT CURRENT CMOS VOLTAGE REGULATOR

Rev.2.2_03

S-1172 Series

7

Power Dissipation of HSOP-6 (Reference)

Power dissipation of package differs depending on the mounting conditions.

Consider the power dissipation characteristics under the following conditions as reference.

[Mounted board]

(1) Board size:

50 mm

 50 mm  t1.6 mm

(2) Board material:

Glass epoxy resin (two layers)

(3) Wiring ratio:

90%

(4) Test conditions:

When mounted on board (wind speed : 0 m/s)

(5) Land pattern:

Refer to the recommended land pattern (drawing code : FH006-A-L-SD)

0

50

100

150

2400

1600

0

Ambient temperature (Ta) [

C]

800

2000

1200

400

Figure 5 Power Dissipation of Package (When Mounted on Board)

Table 6

Condition

Power Dissipation (Reference)

Thermal Resistance Value (

ja)

HSOP-6 (When mounted on board)

2000 mW

50°C/W

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S-1172B44-U5T1X Datasheet(PDF) 7 Page - ABLIC Inc.

S-1172B44-U5T1X Datasheet(HTML) 7 Page - ABLIC Inc.

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