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CDALA10M7GA052 Datasheet(PDF) 45 Page - Murata Manufacturing Co., Ltd. |
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CDALA10M7GA052 Datasheet(HTML) 45 Page - Murata Manufacturing Co., Ltd. |
45 / 57 page Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested to approve our product specification or to transact the approval sheet for product specification, before your ordering. P61E7.pdf 01.10.17 Chip Type Discriminators CDSCA Series Notice 44 12 s Notice (Soldering and Mounting) 1. Standard Reflow Soldering Condition (1) Reflow The component cannot be withstand washing. 2. Wash Lead terminal is directly contacted with the tip of soldering iron of +280 ±5°C for 3.0 seconds±0.5 seconds. (2) Soldering Iron 5 sec Gradual Cooling 150 240 260 60 60 Time (sec.) s Notice (Handling) 1. The component mounted on the PCB may be damaged if excess mechanical stress is applied. 2. Layout the components on the PCB to minimize the stress imposed by the warp or flexure of the board. 3. After installing components, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to be lower. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. 4. When the positioning claw or pick up nozzle are worn, the excess load is applied to the components while positioning or placing are performed. Careful checking and maintenance are necessary to prevent unexpected trouble. 5. When correcting component's position with a soldering iron, the tip of the soldering iron should not directly touch the chip component. Depending on the soldering conditions, the effective area of terminations may be reduced. The use of solder containing Ag should be considerd to prevent the electrode erosion. 6. Do not clean or wash the component as it is not hermetically sealed. 7. In case of overcoating the part, coating conditions such as material, curing temperature, and so on must be evaluated deeply. 8. Accurate test circuit values are required to measure electrical characteristics. It may be a cause of mis-correlation if there is any deviation, especially stray capacitance, from the test circuit in the specification. [Component direction] [Component layout close to board] Put the component laterally to the direction in which stress acts. Susceptibility to stress is in the order of : A>C>B B A C Slit Perforation |
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