WeEn Semiconductors

MAC223A8X

4Q Triac

MAC223A8X

All information provided in this document is subject to legal disclaimers.

Product data sheet

15 September 2018

6 / 13

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

full or half cycle; without heatsink

compound; Fig. 6

-

-

5.5

K/W

thermal resistance

from junction to

heatsink

full or half cycle; with heatsink

compound; Fig. 6

-

-

3.85

K/W

thermal resistance

from junction to

ambient free air

in free air

-

55

-

K/W

aaa-010105

1

10

(K/W)

1

10

(1)

(2)

(3)

(4)

P

t

(1) Unidirectional (half cycle) without heatsink compound

(2) Unidirectional (half cycle) with heatsink compound

(3) Bidirectional (full cycle) without heatsink compound

(4) Bidirectional (full cycle) with heatsink compound

Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration

9. Isolation characteristics

Table 6. Isolation characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

RMS isolation voltage from all terminals to external heatsink;

sinusoidal waveform; clean and dust

free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;

-

-

2500

V

isolation capacitance

from main terminal 2 to external

-

10

-

pF