MC33063AP1 datasheet(10/12 Pages) ONSEMI

No. de pieza	MC33063AP1

Descripción Electrónicos	DC-to-DC CONVERTER CONTROL CIRCUITS

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MC34063A MC33063A

10

MOTOROLA ANALOG IC DEVICE DATA

P, P1 SUFFIX

PLASTIC PACKAGE

CASE 626–05

ISSUE K

OUTLINE DIMENSIONS

D SUFFIX

PLASTIC PACKAGE

CASE 751–05

(SO–8)

ISSUE P

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR

SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

MIN

MAX

MILLIMETERS

INCHES

DIM

9.40

6.10

3.94

0.38

1.02

0.76

0.20

2.92

—

0.76

10.16

6.60

4.45

0.51

1.78

1.27

0.30

3.43

0.370

0.240

0.155

0.015

0.040

0.030

0.008

0.115

—

0.030

0.400

0.260

0.175

0.020

0.070

0.050

0.012

0.135

10

°

1.01

2.54 BSC

7.62 BSC

0.100 BSC

0.300 BSC

A

B

C

D

F

G

H

J

K

L

M

N

10

°

0.040

F

H

G

D

N

C

K

M

J

L

NOTE 2

14

5

8

T

0.13 (0.005)

AB

M

–A–

–B–

–T–

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

SEATING

PLANE

14

5

8

C

K

4X

P

A

0.25 (0.010) M TB SS

0.25 (0.010) M

B M

8X

D

R

M

J

X 45

_

F

–A–

–B–

–T–

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

4.80

5.00

0.189

0.196

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.18

0.25

0.007

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.229

0.244

R

0.25

0.50

0.010

0.019

_

__

_

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