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DRV8889-Q1 Datasheet(PDF) 86 Page - Texas Instruments |
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DRV8889-Q1 Datasheet(HTML) 86 Page - Texas Instruments |
86 / 88 page www.ti.com EXAMPLE STENCIL DESIGN 24X (1.5) 24X (0.45) 22X (0.65) (5.8) (R0.05) TYP (4.02) BASED ON 0.125 THICK STENCIL (2.96) BASED ON 0.125 THICK STENCIL PowerPAD TSSOP - 1.2 mm max height PWP0024N SMALL OUTLINE PACKAGE 4224477/A 08/2018 2.50 X 3.40 0.175 2.70 X 3.67 0.15 2.96 X 4.02 (SHOWN) 0.125 3.31 X 4.49 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 8X SYMM SYMM 1 12 13 24 METAL COVERED BY SOLDER MASK SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES 25 |
Número de pieza similar - DRV8889-Q1_V02 |
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Descripción similar - DRV8889-Q1_V02 |
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