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LM27241MTCX Datasheet(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No. de pieza LM27241MTCX
Descripción Electrónicos  Synchronous Buck Regulator Controller for Mobile Systems
Download  27 Pages
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Fabricante Electrónico  NSC [National Semiconductor (TI)]
Página de inicio  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM27241MTCX Datasheet(HTML) 7 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Specifications with standard typeface are for T
J = 25˚C, and those with boldface apply over full Operating Junction Tempera-
ture range. VDD = V5 = 5V, V
SGND =VPGND = 0V, VIN = 15V, VEN = 3V, RFADJ = 22.1K unless otherwise stated (Note 5).
Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Symbol
Parameter
Conditions
Min
Typical
(Note 7)
Max
Units
I
ILIM
ILIM Pin Current (sourcing)
V
ILIM =0V
46
62
76
µA
V
ILIM_TH
I
ILIM Threshold Voltage
-10
0
10
mV
V
SW_ZERO
Zero-cross Threshold (SW
Pin)
LDRV goes low
-2.2
mV
Oscillator
F
OSC
PWM Frequency
R
FADJ = 22.1k
255
300
345
kHz
R
FADJ = 12.4k
500
R
FADJ = 30.9k
200
V
RAMP
PWM Ramp Peak-to-peak
Amplitude
VIN = 15V
1.6
V
VIN = 24V
2.95
V
VALLEY
PWM Ramp Valley
0.8
V
∆F
OSC_VIN
Frequency Change with
VIN
VIN = 5.5V to 24V
±1%
∆F
OSC_VDD
Frequency Change with
VDD
VDD = 4.5V to 5.5V
±2%
V
FREQ_VIN
FREQ Pin Voltage vs. VIN
0.105
V/V
System
t
ON_MIN
Minimum ON Time
V
FPWM =3V
30
ns
D
MAX
Maximum Duty Cycle
VIN = 5.5V
60
75
%
VIN = 15V
40
50
%
VIN = 28V, VDD= 4.5V
22
28
%
Gate Drivers
R
HDRV_SOURCE
HDRV Source Impedance
HDRV Pin Current
(sourcing)= 1.2A
7
R
HDRV_SINK
HDRV Sink Impedance
HDRV Pin Current (sinking)
=1A
2
R
LDRV_SOURCE
LDRV Source Impedance
LDRV Pin Current (sourcing)
= 1.2A
7
R
LDRV_SINK
LDRV Sink Impedance
LDRV Pin Current (sinking)
=2A
1
t
DEAD
Cross-conduction
Protection Delay
(deadtime)
HDRV Falling to LDRV
Rising
40
ns
LDRV Falling to HDRV
Rising
70
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table.
Note 2: PGND and SGND are all electrically connected together on the PCB.
Note 3: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the
ambient temperature, and
θJA is the junction-to-ambient thermal resistance of the specified package. The 0.75W rating of the TSSOP-20 package for example results
from using 125˚C, 25˚C, and 118˚C/W for TJMAX,TA, and θJA respectively. The rated power dissipation should be derated by 10mW/˚C above 25˚C ambient for the
TSSOP package. The
θJA value above represents the worst-case condition with no heat sinking. Heat sinking will permit more power to be dissipated at higher
ambient temperatures. For detailed information on soldering plastic TSSOP package, refer to http://www.national.com/packaging/.
Note 4: ESD is applied by the human body model, which is a 100pF capacitor discharged through a 1.5 k
Ω resistor into each pin.
Note 5: RFADJ is the frequency adjust resistor between FREQ pin and Ground.
Note 6: If the LM27241 starts up with a pre-charged soft start capacitor, it will first discharge the capacitor to VSS_RESET and then begin the normal Soft-start
process.
Note 7: Typical numbers are at 25˚C and represent the most likely norm.
www.national.com
7


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