Philips Semiconductors

Product specification

TOPFET dual high side switch

BUK218-50DC

MECHANICAL DATA

Fig.4. SOT427 surface mounting package

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT427

0

2.5

5 mm

scale

7 leads (one lead cropped)

SOT427

ee

e

e

e

e

E

b

A1

A

A1

Lp

bc

e

A

UNIT

DIMENSIONS (mm are the original dimensions)

E

mm

4.50

4.10

1.40

1.27

0.85

0.60

0.64

0.46

2.90

2.10

HD

15.80

14.80

Q

2.60

2.20

10.30

9.70

D1

1.60

1.20

1.27

D

max.

11

1

4

7

mounting

base

D1

HD

D

Q

Lp

c

99-06-25

01-04-18

1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.

For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.

October 2001

8

Rev 2.010