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AMMC-6231 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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AMMC-6231 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
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7 / 8 page  7 Biasing and Operation The AMMC-6231 is normally biased with a positive supply connected to both VD1 and VD2 bond pads through the 100pF bypass capacitor as shown in Figure 21. The recommended supply voltage is 3 V. It is important to place the bypass capacitor as close to the die as possible. No negative gate bias voltage is needed for the AMMC-6231. Input and output matching are achieved on-die, therefore no other external component is required besides one 100pF bypass capacitor for the main supply. The input and output are DC- blocked with internal coupling capacitors. No ground wires are needed because all ground connections are made with plated through- holes to the backside of the device. Refer the Absolute Maximum Ratings table for allowed DC and thermal conditions. Assembly Techniques The backside of the MMIC chip is RF ground. For microstrip applications the chip should be attached directly to the ground plane (e.g. circuit carrier or heatsink) using electrically conductive epoxy [1] For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it. This can be accomplished by mounting a gold plate metal shim (same length and width as the MMIC) under the chip which is of correct thickness to make the chip and adjacent circuit the same height. The amount of epoxy used for the chip and/or shim attachment should be just enough to provide a thin fillet around the bottom perimeter of the chip or shim. The ground plan should be free of any residue that may jeopardize electrical or mechanical attachment. The location of the RF bond pads is shown in Figure 12. Note that all the RF input and output ports are in a Ground- Signal-Ground configuration. RF connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. A single bond wire is normally sufficient for signal connections, however double bonding with 0.7 mil gold wire or use of gold mesh [2] is recommended for best performance, especially near the high end of the frequency band. Thermosonic wedge bonding is preferred method for wire attachment to the bond pads. Gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams and a ultrasonic power of roughly 55 dB for a duration of 76 +/- 8 mS. The guided wedge at an untrasonic power level of 64 dB can be used for 0.7 mil wire. The recommended wire bond stage temperature is 150 +/- 2C. Caution should be taken to not exceed the Absolute Maximum Rating for assembly temperature and time. The chip is 100um thick and should be handled with care. This MMIC has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up the die with a vacuum on die center). This MMIC is also static sensitive and ESD precautions should be taken Notes: [1] Ablebond 84-1 LM1 silver epoxy is recommended. [2] Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824 Figure 17. AMMC-6231 Simplified Schematic RFout RFin VD1 VD2 |
Número de pieza similar - AMMC-6231 |
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Descripción similar - AMMC-6231 |
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