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MSM6660-01 Datasheet(PDF) 18 Page - OKI electronic componets |
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MSM6660-01 Datasheet(HTML) 18 Page - OKI electronic componets |
18 / 18 page ¡ Semiconductor MSM6660-01,02,03 18/18 (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP80-P-1420-0.80-BK Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP. Mirror finish |
Número de pieza similar - MSM6660-01 |
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Descripción similar - MSM6660-01 |
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