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FDC658AP Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FDC658AP Datasheet(HTML) 4 Page - Fairchild Semiconductor |
4 / 5 page FDC658AP Rev. B (W) www.fairchildsemi.com 4 Figure 7. 0 2 4 6 8 10 02468 10 Qg, GATE CHARGE (nC) ID = -4A VDS = -5V -10V -15V Gate Charge Characteristics Figure 8. 0 150 300 450 600 0 6 12 18 24 30 -VDS, DRAIN TO SOURCE VOLTAGE (V) Ciss Coss Crss f = 1 MHz VGS = 0 V Capacitance vs Drain to Source Voltage Figure 9. 0.01 0.1 1 10 100 0.1 1 10 100 -VDS, DRAIN TO SOURCE VOLTAGE (V) DC 1s 100ms 100us rDS(on) LIMIT VGS = -10V SINGLE PULSE RθJA = 156 oC/W TA = 25 oC 10ms 1ms Forward Bias Safe Operating Area Figure 10. 0 2 4 6 8 10 0.01 0.1 1 10 100 t, PULSE WIDTH (s) SINGLE PULSE RθJA = 156°C/W TA = 25°C Single Pulse Maximum Power Dissipation Figure 11. 0.001 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 t, RECTANGULAR PULSE DURATION RθJA(t) = r(t) + RθJA RθJA = 156 oC/W TJ - TA = P * RθJA(t) Duty Cycle, D = t1/ t2 P(pk) t1 t2 SINGLE PULSE 0.01 0.02 0.05 0.1 0.2 D = 0.5 Transient Thermal Response Curve Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. Typical Characteristics |
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