SMM766

Preliminary Information

Summit Microelectronics, Inc

2086 2.1 12/13/2005

8

Temperature Under Bias....................... -55

Storage Temperature............................ -65

Terminal Voltage with Respect to GND:

VDD Supply Voltage ......................... -0.3V to 6.0V

12VIN Supply Voltage ..................... -0.3V to 15.0V

Output Short Circuit Current ............................... 100mA

Lead Solder Temperature (10 s).......................... 300

Junction Temperature ......................................... .150°C

ESD Rating per JEDEC ....................................... 2000V

Latch-Up testing per JEDEC.............................

Note - The device is not guaranteed to function outside its operating rating.

Stresses listed under Absolute Maximum Ratings may cause permanent

damage to the device. These are stress ratings only and functional operation

of the device at these or any other conditions outside those listed in the

operational sections of the specification is not implied. Exposure to any

absolute maximum rating for extended periods may affect device performance

and reliability.

Devices are ESD sensitive. Handling precautions are

recommended.

Temperature Range (Industrial)...........–40

(Commercial) ..............0

VDD Supply Voltage .................................. 2.7V to 5.5V

12VIN Supply Voltage

VIN ............................................................ GND to VDD

VOUT ...................................................... GND to 14.0V

Package Thermal Resistance (

48 Lead TQFP ................................................80

Moisture Classification Level 1 (MSL 1) per J-STD- 020

Note 1 – Range depends on internal regulator set to 3.6V or 5.5V

see 12VIN specification below.

RELIABILITY CHARACTERISTICS

Data Retention .............................................. 100 Years

Endurance..............................................100,000 Cycles

DC OPERATING CHARACTERISTIC

(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)

Symbol

Parameter

Notes

Min

Typ

Max

Uni

t

VDD

Supply voltage

2.7

5.5

V

Internally regulated to 5.5V

10

14

V

12VIN

Supply voltage

Internally regulated to 3.6V

6

14

V

Power supply current from VDD

All TRIM pins floating,

12VIN floating

3

5

mA

Power supply current from

12VIN

All TRIM pins floating,

VDD floating

3

5

mA

TRIM characteristics

TRIM sourcing maximum

current

1.5

mA

TRIM output current through

100

Ω to 1.0V

TRIM sinking maximum

current

1.5

mA

Margin and ADOC range

Depends on TRIM range of

DC-DC converter

VREF/4

VDD

V

TRIM_CAP characteristics

TRIM output current through

1uF capacitor to ground

Max acceptable board and

cap leakage is 50 nA

2

100

nA

All other input and output characteristics

VDD = 2.7V

0.8 x

VDD_CAP

V

Input high voltage (MR#, SDA,

SCL, PWR_ON, SEQ_LINK,

FS#)

3

VDD = 5.0V

0.7 x

VDD_CAP

V

VDD = 2.7V

0.2 x

VDD_CAP

V

Input low voltage (MR#, SDA,

SCL, PWR_ON, SEQ_LINK,

FS#)

3

VDD = 5.0V

0.3 x

VDD_CAP

V

ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS