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1.2
1.0
1.0
1.5
Dimensions (mm)
Model
A
B
C
D
E
packaging quantity
Min Max
Min Max
Min Max
Min
Min
Max
tape
SMD0805P010TS/TF
2.00
2.20
1.20
1.50
0.55
1.00
0.10
0.20
0.45
4,000
SMD0805P020TS/TF
2.00
2.20
1.20
1.50
0.55
1.00
0.10
0.20
0.45
4,000
SMD0805P035TS/TF
2.00
2.20
1.20
1.50
0.45
0.75
0.10
0.20
0.45
4,000
SMD0805P050TS/TF
2.00
2.20
1.20
1.50
0.75
1.25
0.10
0.20
0.45
3,000
SMD0805P075TS/TF
2.00
2.20
1.20
1.50
0.75
1.25
0.20
0.15
0.45
3,000
SMD0805P100TS/TF
2.00
2.20
1.20
1.50
0.80
1.80
0.20
0.15
0.45
2,000
SMD0805P010TS/TF
0.10
0.30
15
40
1.50 @ 0.50
0.5
1.000
3.500
6.000
•
•
SMD0805P020TS/TF
0.20
0.50
9
40
0.02 @ 8.00
0.5
0.650
2.000
3.500
•
•
SMD0805P035TS/TF
0.35
0.75
6
40
0.10 @ 8.00
0.5
0.250
0.750
1.200
•
•
SMD0805P050TS/TF
0.50
1.00
6
40
0.10 @ 8.00
0.5
0.150
0.500
0.850
•
•
SMD0805P075TS/TF
0.75
1.50
6
40
0.20 @ 8.00
0.6
0.090
t.b.d.
0.350
p p
SMD0805P100TS/TF
1.00
1.95
6
40
0.30 @ 8.00
0.6
0.060
t.b.d.
0.210
p p
Model
I
hold
I
Trip
V
max. dc
I
max.
max. time to trip
P
d max.
Resistance
Approvals
(A)
(A)
(V)
(A)
(sec. @ A)
(W)
R
min.(Ω)
R
typ.(Ω) RI max.(Ω)
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
Order
Qty.
Order-
Model
Packaging
Information
Number
Please choose TS for SnPb and TF for Sn plating
POLYFUSE® RESETTABLE FUSES
Dimensions (mm)
Specifications
Packaging
A
Blistertape and reel Ø 178 mm
Materials
Terminals:
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Solder Material: Sn
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
SMD Type, 6 V / 9 V / 15V
Standard
UL 1434 1st Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TÜV
Features
These devices offer wide range in hold currents
from 0.1 A to 1.0 A and voltages from 6 V to
15 V. The SMD0805 product line is suitable for
high density circuit board applications in com-
puters, cellular phone and general electronics.
Suitable for reflow soldering.
WebLinks
Further info see:
www.wickmanngroup.com
Further application info see fuseology:
www.wickmanngroup.com/download/fuseology.pdf
SMD0805
formerly No. 725
Solder pad Layout (mm)
NOTE:
I
hold =
Hold current: maximum current device will pass without tripping in 20 °C still air.
I
trip =
Trip current: minimum current at which the device will trip in 20 °C still air.
V
max =
Maximum voltage device can withstand without damage at rated current (I
max)
I
max =
Maximum fault current device can withstand without damage at rated voltage (V
max)
P
d =
Power dissipated from device when in the tripped state at 20 °C still air.
R
min=
Minimum resistance of device in initial (un-soldered) state.
R
1max=
Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
Specifications are subject to change without notice