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LMV1015-15 Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LMV1015-15 Datasheet(HTML) 4 Page - National Semiconductor (TI) |
4 / 11 page Connection Diagram Large Dome 4-Bump micro SMD 20128903 Top View Note: - Pin numbers are referenced to package marking text orientation. - The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably. Package marking does not correlate to device type in any way. Ordering Information Package Part Number Package Marking Transport Media NSC Drawing 4-Bump Extreme Thin micro SMD (0.3 mm max height) lead free only LMV1015XR-15 Date Code 250 Units Tape and Reel XRA04ADA LMV1015XRX-15 3k Units Tape and Reel LMV1015XR-25 250 Units Tape and Reel LMV1015XRX-25 3k Units Tape and Reel 4-Bump Ultra-Thin micro SMD (0.4 mm max height) lead free only LMV1015UR-15 Date Code 250 Units Tape and Reel URA04ADA LMV1015URX-15 3k Units Tape and Reel LMV1015UR-25 250 Units Tape and Reel LMV1015URX-25 3k Units Tape and Reel Note: All packages are supplied with large dome bump technology for 1kg adhesion criteria. www.national.com 4 |
Número de pieza similar - LMV1015-15 |
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Descripción similar - LMV1015-15 |
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