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H02N60S Datasheet(PDF) 5 Page - Hi-Sincerity Mocroelectronics |
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H02N60S Datasheet(HTML) 5 Page - Hi-Sincerity Mocroelectronics |
5 / 6 page HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : MOS200504 Issued Date : 2005.05.01 Revised Date : 2005.09.28 Page No. : 5/6 H02N60SI, H02N60SJ, H02N60SE, H02N60SF HSMC Product Specification TO-220AB Dimension TO-220FP Dimension Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 A B E G I K M O P 3 2 1 C N H D Tab F J L Marking: Control Code Date Code H 02 Pb Free Mark Pb-Free: " . " (Note) Normal: None N6 E 0S Note: Green label is used for pb-free packing Pin Style: 1.Gate 2 & Tab.Drain 3.Source Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead TO-220AB Plastic Package HSMC Package Code: E DIM Min. Max. A 5.58 7.49 B 8.38 8.90 C 4.40 4.70 D 1.15 1.39 E 0.35 0.60 F 2.03 2.92 G 9.66 10.28 H - *16.25 I- *3.83 J 3.00 4.00 K 0.75 0.95 L 2.54 3.42 M 1.14 1.40 N- *2.54 O 12.70 14.27 P 14.48 15.87 *: Typical, Unit: mm Marking: Control Code Date Code H 02 Pb Free Mark Pb-Free: " . " (Note) Normal: None N6 F 0S Note: Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead TO-220FP Plastic Package HSMC Package Code: F A D F G I K L M 3 2 1 C J N α3 E α2 O α4 α5 α1 DIM Min. Max. A 6.48 7.40 C 4.40 4.90 D 2.34 3.00 E 0.45 0.80 F 9.80 10.36 G 3.10 3.60 I 2.70 3.43 J 0.60 1.00 K 2.34 2.74 L 12.48 13.60 M 15.67 16.20 N 0.90 1.47 O 2.00 2.96 α1/2/4/5 -*5o α3 -*27o *: Typical, Unit: mm |
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