1999 Sep 27

11

Philips Semiconductors

Product specification

Quad buffer/line driver; 3-state

74AHC125; 74AHCT125

PACKAGE OUTLINES

UNIT

A

max.

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT108-1

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

7

8

1

14

y

076E06S

MS-012AB

pin 1 index

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

95-01-23

97-05-22

0

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1