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74AVC16836DGG Datasheet(PDF) 2 Page - NXP Semiconductors |
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74AVC16836DGG Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 10 page Philips Semiconductors Preliminary specification 74AVC16836 20-bit registered driver with inverted register enable (3-State) 2 1999 Jul 23 FEATURES • Wide supply voltage range of 1.2 V to 3.6 V • Complies with JEDEC standard no. 8-1A/5/7. • CMOS low power consumption • Input/output tolerant up to 3.6 V • DCO (Dynamic Controlled Output) circuit dynamically changes output impedance, resulting in noise reduction without speed degradation • Low inductance multiple V CC and GND pins for minimum noise and ground bounce • Power off disables 74AVC16836 outputs, permitting Live Insertion DESCRIPTION The 74AVC16836 is a 20-bit universal bus driver. Data flow is controlled by output enable (OE), latch enable (LE) and clock inputs (CP). This product is designed to have an extremely fast propagation delay and a minimum amount of power consumption. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor (Live Insertion). A Dynamic Controlled Output (DCO) circuitry is implemented to support termination line drive during transient. See the graphs on page 8 for typical curves. PIN CONFIGURATION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 OE Y0 Y1 Y2 Y3 Y4 Y5 Y6 GND VCC GND Y7 Y8 Y9 Y10 Y11 Y12 GND Y13 Y14 Y15 VCC Y16 Y17 GND Y18 Y19 NC CP A0 A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 A19 LE SH00159 QUICK REFERENCE DATA GND = 0 V; Tamb = 25°C; tr = tf ≤ 2.0 ns; CL = 30 pF. SYMBOL PARAMETER CONDITIONS TYPICAL UNIT tPHL/tPLH Propagation delay An to Yn VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V 2.6 2.0 1.7 ns tPHL/tPLH Propagation delay LE to Yn; CP to Yn VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V 3.0 2.4 2.0 ns CI Input capacitance 5.0 pF CPD Power dissipation capacitance per buffer VI = GND to VCC1 Outputs enabled 25 pF CPD Power dissi ation ca acitance er buffer VI = GND to VCC1 Output disabled 6 F NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs. ORDERING INFORMATION PACKAGES TEMPERATURE RANGE ORDER CODE DRAWING NUMBER 56-Pin Plastic Thin Shrink Small Outline (TSSOP) Type II –40 °C to +85°C 74AVC16836 DGG SOT364-1 |
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