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TPS65023 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS65023 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 43 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS TPS65023 SLVS670A – JUNE 2006 – REVISED JUNE 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE(1) PART NUMBER(2) –40 °C to 85°C 40 pin QFN (RSB) TPS65023RSB (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) The RSB package is available in tape and reel. Add the R suffix (TPS65023RSBR) to order quantities of 2500 parts per reel. Add the T suffix (TPS65023RSBT) to order quantities of 250 parts per reel. over operating free-air temperature range (unless otherwise noted) VALUE UNIT VI Input voltage range on all pins except AGND and PGND pins with respect to AGND –0.3 to 7 V Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3 2000 mA Peak current at all other pins 1000 mA Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature –40 to 85 °C TJ Maximum junction temperature 125 °C Tstg Storage temperature –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING RHA(1)(2) 2.85 W 28 mW/ °C 1.57 W 1.14 W (1) The thermal resistance junction to ambient of the RHA package is 35 °C/W measured on a high K board. (2) The thermal resistance junction to case (exposed pad) of the RHA package is 5 °C/W over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input voltage range step-down converters VCC 2.5 6 V (VINDCDC1, VINDCDC2, VINDCDC3) Output voltage range for VDCDC1 step-down converter(1) 0.6 VINDCDC1 VO Output voltage range for VDCDC2 (mem) step-down converter(1) 0.6 VINDCDC2 V Output voltage range for VDCDC3 (core) step-down converter(1) 0.6 VINDCDC3 VI Input voltage range for LDOs (VINLDO1, VINLDO2) 1.5 6.5 V VO Output voltage range for LDOs (VLDO1, VLDO2) 1 VINLDO1-2 V IO(DCDC2) Output current at L1 1500 mA Inductor at L1(2) 2.2 3.3 µH CI(DCDC1) Input capacitor at VINDCDC1 (2) 10 µF CO(DCDC1) Output capacitor at VDCDC1 (2) 10 22 µF IO(DCDC2) Output current at L2 1200 mA Inductor at L2 (2) 2.2 3.3 µH (1) When using an external resistor divider at DEFDCDC3, DEFDCDC2, DEFDCDC1 (2) See Applications Information section for more information. 2 Submit Documentation Feedback |
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