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HCPL-655K Datasheet(PDF) 4 Page - Agilent(Hewlett-Packard)

No. de pieza HCPL-655K
Descripción Electrónicos  Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications
Download  14 Pages
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Fabricante Electrónico  HP [Agilent(Hewlett-Packard)]
Página de inicio  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-655K Datasheet(HTML) 4 Page - Agilent(Hewlett-Packard)

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4
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
8 Pin Ceramic DIP Single Channel Schematic
Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
channels with separate VCC and ground connections.
Functional Diagrams
ANODE
3
CATHODE
6
5
V O
GND
IO
IF
2
+
-
V F
8
V CC
7
V B
IB
ICC
16 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
Through Hole
Through Hole
Through Hole
Unformed Leads
Surface Mount
2 Channels
1 Channel
2 Channels
4 Channels
2 Channels
1
3
2
4
8
6
7
5
V CC
GND
V OUT
V B
1
3
2
4
8
6
7
5
V CC
GND
V O2
V O1
5
7
6
8
12
10
11
9
GND
V O4
V O3
1
3
2
4
16
14
15
13
V CC
V O2
V O1
GND 1
V B2
19
20
2
3
V O1
8
7
V CC2
V CC1
10
GND 2
15
13
12
14
V O2
V B1
9
5
7
6
8
12
10
11
9
GND
V CC2
V B2
1
3
2
4
16
14
15
13
V CC1
GND
V O1
V O2
V B1
0.20 (0.008)
0.33 (0.013)
4.45 (0.175)
MAX.
20.06 (0.790)
20.83 (0.820)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
Note, base is pin 7.


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