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1N5956BG Datasheet(PDF) 1 Page - Microsemi Corporation |
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1N5956BG Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page Axial-Leaded 1.5 Watt Zener Diodes Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2003 11-03-2003 REV B SCOTTSD A L E DIVISION 1N5913BG thru 1N5956BG (Glass) DESCRIPTION APPEARANCE The 1N5913BG-5956BG series of 1.5 watt Zeners provides voltage regulation in a selection from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part. These glass encapsulated Zeners with a G suffix provide hermetic-sealed qualities and higher rated temperature when required beyond that optionally provided in equivalent plastic-body constructions (P suffix) for the same JEDEC part numbers. Both package options are available by Microsemi. A variety of other Zener product offerings and packages are available by Microsemi to meet higher or lower power and test-current applications. DO-41 or DO-204AL (Glass) IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • JEDEC registered 1N5913B to 1N5956B • Zener voltage available 3.3V to 200V • Standard voltage tolerances are plus/minus 5% with B suffix and 10 % with A suffix identification • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively • Options for screening in accordance with MIL-PRF- 19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. • Surface mount equivalents available as SMBJ5913 to SMBJ5956B, SMBG5913 to SMBG5956B, or MLL5913B to MLL5956B • Plastic body axial-leaded Zener equivalents are also available as 1N5913BP to 1N5956BP • Regulates voltage over a broad operating current and temperature range • Wide selection from 3.3 to 200 V • Flexible axial-lead mounting terminals • Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance in glass hermetically sealed package • Nonsensitive to ESD • Hermetically sealed glass body construction • Specified capacitance (see Figure 3) • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS MECHANICAL AND PACKAGING • Power dissipation at 25 ºC: 1.5 watts (also see derating in Figure 1). • Operating and Storage temperature: -65 ºC to +175 ºC • Thermal Resistance: 60 ºC/W junction to lead at 3/8 (10 mm) lead length from body, or 120 ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with 4 mm 2 copper pads and track width 1 mm, length 25 mm • Steady-State Power: 1.5 watts at TL < 85 oC 3/8 inch (10 mm) from body, or 1.25 watts at TA = 25 ºC when mounted on FR4 PC board as described for thermal resistance (also see Figure 1) • Forward voltage @200 mA: 1.2 volts (maximum) • Solder Temperatures: 260 ºC for 10 s (max) • CASE: Hermetically sealed axial-lead glass package • TERMINALS: Leads, tin-lead plated solderable per MIL-STD-750, method 2026 • POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation • MARKING: Part number • TAPE & REEL optional: Standard per EIA-296 (add “TR” suffix to part number) • WEIGHT: 0.4 grams • See package dimensions on last page |
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