MOTOROLA CMOS LOGIC DATA

9

MC14549B MC14559B

OUTLINE DIMENSIONS

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751G–02

ISSUE A

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

10.15

10.45

0.400

0.411

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.50

0.90

0.020

0.035

G

1.27 BSC

0.050 BSC

J

0.25

0.32

0.010

0.012

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

M

B

M

0.010 (0.25)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

–A–

–B–

P

8X

G

14X

D

16X

SEATING

PLANE

–T–

S

A

M

0.010 (0.25)

T

16

9

8

1

F

J

_

_

_

_

_

M

C

K

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51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,

and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided

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are registered

trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

MC14549B/D

*MC14549B/D*

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