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BC807W Datasheet(PDF) 3 Page - NXP Semiconductors |
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BC807W Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 8 page 1999 May 18 3 Philips Semiconductors Product specification PNP general purpose transistor BC807W THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tamb =25 °C unless otherwise specified. Note 1. Pulse test: tp ≤ 300 µs; δ≤ 0.02. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 625 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = −20 V −−100 nA IE = 0; VCB = −20 V; Tj = 150 °C −−5 µA IEBO emitter cut-off current IC = 0; VEB = −5V −−100 nA hFE DC current gain IC = −100 mA; VCE = −1 V; note 1; see Figs 2, 3 and 4 BC807W 100 600 BC807-16W 100 250 BC807-25W 160 400 BC807-40W 250 600 DC current gain IC = −500 mA; VCE = −1 V; note 1 40 − VCEsat collector-emitter saturation voltage IC = −500 mA; IB = −50 mA; note 1 −−700 mV VBE base-emitter voltage IC = −500 mA; VCE = −1 V; note 1 −−1.2 V Cc collector capacitance IE =ie = 0; VCB = −10 V; f = 1 MHz − 10 pF fT transition frequency IC = −10 mA; VCE = −5 V; f = 100 MHz 80 − MHz |
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