1999 Apr 21

5

Philips Semiconductors

Product specification

NPN power transistor

BD230

PACKAGE OUTLINE

UNIT

cD

E

e1

LQ

w

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.88

0.65

2.7

2.3

0.60

0.45

11.1

10.5

7.8

7.2

2.29

e

4.58

0.254

P

3.2

3.0

P1

3.9

3.6

DIMENSIONS (mm are the original dimensions)

Note

1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.

16.5

15.3

1.5

0.9

max

2.54

SOT32

TO-126

97-03-04

0

2.5

5 mm

scale

A

Plastic single-ended leaded (through hole) package; mountable to heatsink, 1 mounting hole; 3 leads

SOT32

D

P1

P

E

e1

A

L

Q

c

bp

12

3

L1

e