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BF869 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BF869 Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 8 page 1999 Apr 12 4 Philips Semiconductors Product specification NPN high-voltage transistors BF869; BF871 PACKAGE OUTLINE UNIT bp DE1 L1 L2 (1) max L cc1 E PQ w REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.8 0.6 0.65 0.5 0.56 0.46 8.6 8.4 10.1 9.9 10.4 10.0 2.54 13.3 12.2 e1 5.08 eHE 24.2 23.8 2.4 2.0 3.8 3.6 P1 3.9 3.7 0.25 1.7 1.5 DIMENSIONS (mm are the original dimensions) 2.5 SOT128B TO-202 97-02-28 A c1 D E L1 L2 L bp c E1 HE P Q A P1 4.6 4.4 Plastic single-ended leaded (through hole) package; with cooling fin, mountable to heatsink, 1 mounting hole; 3 leads (in-line) SOT128B e e1 12 3 0 5 10 mm scale w M Note 1. Plastic flash allowed within this zone |
Número de pieza similar - BF869 |
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Descripción similar - BF869 |
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