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ML401 Datasheet(PDF) 4 Page - WJ Communication. Inc. |
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ML401 Datasheet(HTML) 4 Page - WJ Communication. Inc. |
4 / 4 page Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 June 2006 ML401 1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp Product Information The Communications Edge TM ML401-G Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Mounting Configuration / Land Pattern 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. All dimensions are in millimeters (inches). Angles are in degrees. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 °C Thermal Resistance, Rth 104 °C / W Product Marking The component will be lasermarked with a “ML401-G” product label with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part will be located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes 500V to <1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes 1000V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 2 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Functional Pin Layout Pin Function 1 LO 2 GND 3 Vcc1 4 Vcc2 5 IF 6 GND 7 GND 8 RF Backside paddle is RF and DC ground. 1 2 3 4 8 7 6 5 RF IF GND LO GND Vcc1 Vcc2 GND The backside paddle is Ground. |
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