10

S72WS-P based MCP/PoP Products

S72WS-P_00_A4 May 29, 2006

Da ta

Sh eet

( A dv an ce

In f o r m at io n)

4.1

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

Notes:

1. Packing Type 0 is standard. Specify other options as required.

2. BGA package marking omits leading S and packing type designator from ordering part number.

K

A

11x11 mm

112

0.45 mm

B

11x11 mm

112

0.50 mm

D

12x12 mm

128

0.45 mm

F

12x12 mm

128

0.50 mm

G

14x14 mm

152

0.45 mm

H

14x14 mm

152

0.50 mm

J

15x15 mm

160

0.45 mm

K

15x15 mm

160

0.50 mm

L

17x17 mm

192

0.45 mm

M

17x17 mm

192

0.50 mm

Table 4.1 Character Position Descriptions (Sheet 2 of 2)

Character 12

Character 13

Character 14 Description

Package Area

Package Ball Count

Raw Ball Size

S72WS-P Valid Combinations

NOR Flash

Speed

DRAM

Supplier

DRAM Speed

Package Type

Package

Markings

Base Ordering

Number

Package &

Material Set

Package

Descriptor

Packing Type

S72WS256PD0

KF

K

0, 2, 3 (Note 1)

66 MHz

Type 5

133 MHz

15x15 mm

(PoP)

(Note 2)

HF

6

9x12 mm

(MCP)

S72WS512PE0

HF

6

80 MHz

Type 2

104 MHz

9x12 mm

(MCP)

S72WS512PEF

KF

K

66 MHz

Type 2

133 MHz

15x15 mm

(PoP)

S72WS512PFF

HF

6

66 MHz

Type 1

133 MHz

15x15 mm

(PoP)

JF

9

66 MHz

Type 1

11x13 mm

(MCP)

80 MHz

Type 5

KF

K

66 MHz

Type 1

15x15 mm

(PoP)

80 MHz

Type 5

S72WS512PFG

JF

9

66 MHz

Type 1

133 MHz

11x13 mm

(MCP)

KF

K

15x15 mm

(PoP)