 |
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
|
Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
AD7323BRUZ-REEL Datasheet(PDF) 34 Page - Analog Devices |
|
||||||||||||||||||||||||||||||
AD7323BRUZ-REEL Datasheet(HTML) 34 Page - Analog Devices |
|
|
34 / 36 page  AD7323 Rev. 0 | Page 34 of 36 APPLICATION HINTS LAYOUT AND GROUNDING The printed circuit board that houses the AD7323 should be designed so that the analog and digital sections are confined to certain areas of the board. This design facilitates the use of ground planes that can easily be separated. To provide optimum shielding for ground planes, a minimum etch technique is generally best. All AGND pins on the AD7323 should be connected to the AGND plane. Digital and analog ground pins should be joined in only one place. If the AD7323 is in a system where multiple devices require an AGND and DGND connection, the connection should still be made at only one point. A star point should be established as close as possible to the ground pins on the AD7323. Good connections should be made to the power and ground planes. This can be done with a single via or multiple vias for each supply and ground pin. Avoid running digital lines under the AD7323 device because this couples noise onto the die. However, the analog ground plane should be allowed to run under the AD7323 to avoid noise coupling. The power supply lines to the AD7323 device should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. To avoid radiating noise to other sections of the board, com- ponents, such as clocks, with fast switching signals should be shielded with digital ground and never run near the analog inputs. Avoid crossover of digital and analog signals. To reduce the effects of feedthrough within the board, traces should be run at right angles to each other. A microstrip technique is the best method, but its use may not be possible with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, and signals are placed on the other side. Good decoupling is also important. All analog supplies should be decoupled with 10 μF tantalum capacitors in parallel with 0.1 μF capacitors to AGND. To achieve the best results from these decoupling components, they must be placed as close as possible to the device, ideally right up against the device. The 0.1 μF capacitors should have a low effective series resistance (ESR) and low effective series inductance (ESI), such as is typical of common ceramic and surface mount types of capacitors. These low ESR, low ESI capacitors provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. |
Número de pieza similar - AD7323BRUZ-REEL |
|
Descripción similar - AD7323BRUZ-REEL |
|
|
Enlace URL |
| Política de Privacidad |
| ALLDATASHEET.ES |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Spanish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
