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IBIS4-6600
Datasheet
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com
Document #: 38-05708 Rev.**(Revision 1.3 )
Page 47 of 63
6 Pad positioning and packaging
6.1 Bare die
The IBIS4-6600 image sensor has 68 pins, 17 pins on each side. The die size from
pad-edge to pad-edge (without scribe-line) is
9120.10 µm (X) by 11960.10 µm (Y)
Scribe lines will take about 100 to 150 µm extra on each side.
Pin 1 is located in the middle of the left side, indicated by a “1” on the layout.
A logo and some identification tags can be found on the lower right of the die (see
Figure 25).
Pad 1
Identification
Pad 9
Pad 10
Pad 26
Pad 61
Pad 27
Pad 43
Pad 60
Pad 44
7777.00 µm
(2222 * 3.5)
4404.47 µm
10549.00 µm
(3014 * 3.5)
6427.00 µm
9120.10µm
11960.10µm
Pixel array center
Pixel 0,0
Test diodes
Probe
Bonding
Probe
Bonding
Probe
Bonding
Probe
Bonding
Origin
(0,0)
Figure 27: Layout of the IBIS4-6600 sensor