52 / 63 page
IBIS4-6600
Datasheet
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com
Document #: 38-05708 Rev.**(Revision 1.3 )
Page 52 of 63
Figure 29: Side view (all dimensions in inch).
Table 20: Side view dimensions.
(inch)
(mm)
Dimension
Description
Min
Typ
Max
Min
Typ
Max
A Glass (thickness)
0.037
0.039
0.041
0.950
1.000
1.050
B Die – Si (thickness)
0.029
0.740
C Die attach-bondline (thickness)
0.002
0.004
0.006
0.030
0.060
0.090
D Glass attach-bondline
(thickness)
0.002
0.004
0.006
0.030
0.070
0.110
E Imager to lid-outer surface
0.081
2.048
F Imager to lid-inner surface
0.039
0.978
G Imager to seating plane of pkg
0.061
1.562
Figure 30: Side view dimensions.
A
B - Die
C- Die attach thickness
D- Glass lid sealing thickness
E
F
G