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IBIS4-6600 Datasheet(PDF) 2 Page - Cypress Semiconductor

No. de pieza IBIS4-6600
Descripción Electrónicos  High resolution 6.6 M Pixel Rolling shutter CMOS Image sensor
Download  63 Pages
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Fabricante Electrónico  CYPRESS [Cypress Semiconductor]
Página de inicio  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

IBIS4-6600 Datasheet(HTML) 2 Page - Cypress Semiconductor

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IBIS4-6600
Datasheet
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com
Document #: 38-05708 Rev.**(Revision 1.3 )
Page 2 of 63
Table of contents
1
INTRODUCTION..................................................................................................4
1.1
OVERVIEW .......................................................................................................4
1.2
KEY FEATURES.................................................................................................5
1.3
PART NUMBER ..................................................................................................5
2
SPECIFICATIONS ................................................................................................6
2.1
GENERAL SPECIFICATIONS................................................................................6
2.2
ELECTRO-OPTICAL SPECIFICATIONS .................................................................6
2.2.1
Overview ..................................................................................................6
2.2.2
Spectral response curve ...........................................................................7
2.2.3
Photo-voltaic response curve...................................................................8
2.3
FEATURES AND GENERAL SPECIFICATIONS .......................................................8
2.4
ELECTRICAL SPECIFICATIONS ...........................................................................9
2.4.1
Absolute maximum ratings.......................................................................9
2.4.2
Recommended operating conditions ........................................................9
2.4.3
DC Electrical characteristics ................................................................10
3
SENSOR ARCHITECTURE AND OPERATION ..............................................11
3.1
FLOOR PLAN...................................................................................................11
3.2
PIXEL .............................................................................................................12
3.2.1
Architecture............................................................................................12
3.2.2
FPN and PRNU......................................................................................12
3.2.3
Color filter array....................................................................................13
3.2.4
Dark and dummy pixels .........................................................................14
3.3
PIXEL RATE ....................................................................................................14
3.4
REGION-OF-INTEREST (ROI) READ OUT.........................................................15
3.5
OUTPUT AMPLIFIER ........................................................................................15
3.5.1
Stage 1: Offset, FPN correction and multiplexing.................................16
3.5.2
Stage 2: Programmable gain amplifier .................................................16
3.5.3
Stage 3: Output drivers..........................................................................17
3.5.4
Offset DACs ...........................................................................................18
3.6
SUB-SAMPLING MODES...................................................................................19
3.7
ELECTRONIC SHUTTER....................................................................................25
3.8
HIGH DYNAMIC RANGE MODES.......................................................................26
3.8.1
Double slope integration........................................................................26
3.8.2
Non-destructive readout (NDR).............................................................27
3.9
SEQUENCER....................................................................................................28
3.9.1
Internal registers....................................................................................28
3.9.2
Detailed description of registers............................................................30
3.9.3
Serial to Parallel interface.....................................................................37


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