IBIS4-6600
Datasheet
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: info@Fillfactory.com
Document #: 38-05708 Rev.**(Revision 1.3 )
Page 3 of 63
4
TIMING DIAGRAMS .........................................................................................39
4.1
SEQUENCER CONTROL SIGNALS......................................................................39
4.2
BASIC FRAME AND LINE TIMING .....................................................................39
4.3
PIXEL OUTPUT TIMING....................................................................................40
4.3.1
Two outputs............................................................................................40
4.3.2
Multiplexing to one output.....................................................................41
4.3.3
ADC timing ............................................................................................42
5
PIN LIST ..............................................................................................................43
NOTE ON POWER-ON BEHAVIOR.................................................................................45
6
PAD POSITIONING AND PACKAGING..........................................................47
6.1
BARE DIE........................................................................................................47
6.2
BONDING PADS...............................................................................................48
6.2.1
Probe pad positions ...............................................................................48
6.2.2
Bonding pad positions............................................................................49
6.3
PACKAGE DRAWING .......................................................................................51
6.3.1
Technical drawing of the 68-pins LCC package....................................51
6.3.2
Bonding of the IBIS4-6600 sensor in the 68-pins LCC package ...........54
6.4
GLASS LID SPECIFICATIONS ............................................................................55
6.4.1
Color sensor...........................................................................................55
6.4.2
Monochrome sensor...............................................................................56
7
BOUNDARY SCAN TEST STRUCTURES.......................................................57
8
STORAGE AND HANDLING............................................................................58
8.1
STORAGE CONDITIONS....................................................................................58
8.2
HANDLING AND SOLDER PRECAUTIONS ..........................................................58
9
ORDERING INFORMATION.............................................................................60
APPENDIX A: IBIS4 EVALUATION KIT................................................................62