ADA4899-1

Rev. A | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

12.6 V

Power Dissipation

See Figure 4

Differential Input Voltage

±1.2 V

Differential Input Current

±10 mA

Storage Temperature Range

–65°C to +150°C

Operating Temperature Range

–40°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4899-1

package is limited by the associated rise in junction temperature

the junction temperature. At approximately 150°C, which is the

glass transition temperature, the plastic changes its properties.

Even temporarily exceeding this temperature limit may change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4899-1.

Exceeding a junction temperature of 150°C for an extended

period can result in changes in silicon devices, potentially

causing failure.

The junction temperature is calculated as

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

The difference between the total drive power and the load

power is the drive power dissipated in the package.

()

L

OUT

L

OUT

S

S

S

D

R

V

R

V

V

I

V

P

2

–

2

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

×

+

×

=

() (

)

L

S

S

S

D

R

/

V

I

V

P

2

4

+

×

=

addition, more metal directly in contact with the package leads

from metal traces, through holes, ground, and power planes

plane significantly reduces the overall thermal resistance of the

package.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the exposed paddle

(e-pad) SOIC-8 (70°C/W) and LFCSP (70°C/W) packages on a

AMBIENT TEMPERATURE (°C)

120

–40

–20

0

204060

80

100

0.0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

LFCSP AND SOIC

Figure 4. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.