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TPA3107D2 Datasheet(PDF) 2 Page - Texas Instruments |
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TPA3107D2 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 29 page www.ti.com ABSOLUTE MAXIMUM RATINGS TYPICAL DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS TPA3107D2 SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. over operating free-air temperature range (unless otherwise noted)(1) UNIT VCC Supply voltage AVCC, PVCC –0.3 V to 30 V SHUTDOWN, MUTE –0.3 V to VCC + 0.3 V VI Input voltage GAIN0, GAIN1, RINN, RINP, LINN, LINP, MSTR/SLV, SYNC –0.3 V to VREG + 0.5 V Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –40 °C to 85°C TJ Operating junction temperature range(2) –40 °C to 150°C Tstg Storage temperature range –65 °C to 150°C Human body model (3) (all pins) ±2 kV Electrostatic discharge Charged-device model (4) (all pins) ±500 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The TPA3107D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad. (3) In accordance with JEDEC Standard 22, Test Method A114-B. (4) In accordance with JEDEC Standard 22, Test Method C101-A PACKAGE(1) TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C 64-pin PAP (HTQFP) 5.43 W 43.5 mW/ °C(2) 3.47 W 2.82 W (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) This data was taken using a 2 oz trace and copper pad that is soldered directly to a 2-layer high-k PCB (EVM). These are typical values. See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad. over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT VCC Supply voltage PVCC, AVCC 10 26 V VIH High-level input voltage SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC 2 V VIL Low-level input voltage SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC 0.8 V SHUTDOWN, VI = VCC, VCC = 24 V 125 MUTE, VI = VCC, VCC = 24 V 75 IIH High-level input current µA GAIN0, GAIN1, MSTR/SLV, SYNC, VI = VREG, 2 VCC = 24 V SHUTDOWN, VI = 0, VCC = 24 V 2 IIL Low-level input current µA SYNC, MUTE, GAIN0, GAIN1, MSTR/SLV, VI = 0 V, 1 VCC = 24 V VOH High-level output voltage FAULT, IOH = 1 mA VREG - 0.6 V VOL Low-level output voltage FAULT, IOL = -1 mA AGND + 0.4 V fOSC Oscillator frequency ROSC Resistor = 100 kΩ 200 300 kHz RL Load Resistance 6 Ω TA Operating free-air temperature –40 85 °C 2 Submit Documentation Feedback |
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