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ADT75ARZ-REEL7 Datasheet(PDF) 7 Page - Analog Devices

No. de pieza ADT75ARZ-REEL7
Descripción Electrónicos  -1째C Accurate, 12-Bit Digital Temperature Sensor
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADT75ARZ-REEL7 Datasheet(HTML) 7 Page - Analog Devices

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ADT75
Rev. 0 | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
VDD to GND
–0.3 V to +7 V
SDA Input Voltage to GND
–0.3 V to VDD + 0.3 V
SDA Output Voltage to GND
–0.3 V to VDD + 0.3 V
SCL Input Voltage to GND
–0.3 V to VDD + 0.3 V
OS/ALERT Output Voltage to GND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
–55°C to +150°C
Storage Temperature Range
–65°C to +160°C
Maximum Junction Temperature, TJMAX
150.7°C
8-Lead MSOP (RM-8)
Power Dissipation1, 2
WMAX = (TJMAX − TA)/θJA
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
205.9°C/W
θJC, Junction-to-Case
43.74°C/W
8-Lead SOIC (R-8)
Power Dissipation1, 2
WMAX = (TJMAX − TA)/θJA
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
157°C/W
θJC, Junction-to-Case
56°C/W
IR Reflow Soldering
Peak Temperature
220°C (0°C/5°C)
Time at Peak Temperature
10 sec to 20 sec
Ramp-Up Rate
3°C/sec maximum
Ramp-Down Rate
–6°C/sec maximum
Time 25°C to Peak Temperature
6 minutes maximum
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
260°C (+0°C)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3°C/sec maximum
Ramp-Down Rate
–6°C/sec maximum
Time 25°C to Peak Temperature
8 minutes maximum
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA and θJC. Refer to Figure 3 for a plot of maximum power
dissipation vs. ambient temperature (TA).
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TEMPERATURE (
°C)
1.2
0.8
1.0
0.6
0.2
0.4
0
MAX PD = 3.4mW AT 150
°C
Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-
tion or loss of functionality.


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