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NCP2990 Datasheet(PDF) 1 Page - ON Semiconductor |
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NCP2990 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 13 page © Semiconductor Components Industries, LLC, 2006 September, 2006 − Rev. 0 1 Publication Order Number: NCP2990/D NCP2990 1.3 Watt Audio Power Amplifier with Fast Turn On Time The NCP2990 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2990 is capable of delivering 1.3 W of continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply. The NCP2990 provides high quality audio while requiring few external components and minimal power consumption. It features a low−power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP2990 contains circuitry to prevent from “pop and click” noise that would otherwise occur during turn−on and turn−off transitions. It is a zero pop noise device when a single ended audio input is used. For maximum flexibility, the NCP2990 provides an externally controlled gain (with resistors), as well as an externally controlled turn−on time (with the bypass capacitor). When using a 1 mF bypass capacitor, it offers 60 ms wake up time. Due to its superior PSRR, it can be directly connected to the battery, saving the use of an LDO. This device is available in a 9−Pin Flip−Chip CSP (Lead−Free). Features • 1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply • Superior PSRR: Direct Connection to the Battery • Zero Pop Noise Signature with a Single Ended Audio Input • Ultra Low Current Shutdown Mode: 10 nA • 2.2 V−5.5 V Operation • External Gain Configuration Capability • External Turn−on Time Configuration Capability: 60 ms (1 mF Bypass Capacitor) • Up to 1.0 nF Capacitive Load Driving Capability • Thermal Overload Protection Circuitry • This is a Pb−Free Device* Typical Applications • Portable Electronic Devices • PDAs • Wireless Phones *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 9−Pin Flip−Chip CSP FC SUFFIX CASE 499E PIN CONNECTIONS MBA = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package MARKING DIAGRAMS A3 B3 C3 A2 B2 C2 A1 B1 C1 INM OUTA INP VM_P VM Vp BYPASS OUTB SHUTDOWN 9−Pin Flip−Chip CSP (Top View) 1 See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. ORDERING INFORMATION MBA G AYWW A1 A3 C1 http://onsemi.com |
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